Industry Leaders Applaud New National Semiconductor Prototyping And R&D Facility In Arizona

PHOENIX, AZ (January 10, 2025) — On Monday, the U.S. Commerce Department announced the selection of Arizona and ASU as the site of the third CHIPS for America research and development (R&D) flagship facilities. The new facility bolsters Arizona’s end-to-end semiconductor ecosystem and cements the state as a national hub for digital innovation.

Here’s what leaders from across the country are saying:

SIA President and CEO John Neuffer (LINK)
“The new Arizona facility will benefit from – and build upon – the state’s already-strong semiconductor fabrication and advanced packaging ecosystem.”

President of SEMI Americas Joe Stockunas (LINK)
“Arizona’s commitment to expanding semiconductor manufacturing and advance chip innovations has been bolstered by recent CHIPS Act investments, and having this facility as part of the growing local ecosystem is a natural fit.”

Intel Senior Vice President Sanjay Natarajan (LINK)
“Intel will play a vital role in ensuring the long-term success of this historic research initiative through direct engagement and strategic support.”

TSMC Arizona President Rose Castanares (LINK)
“With our historic $65 billion investment, TSMC Arizona is deeply committed to our US operation, and we look forward to collaborating with industry peers, research leaders and Natcast on its advanced packaging priorities.”

Purdue University President Mung Chiang (LINK)
“Purdue looks forward to building on our collaborations with ASU colleagues in this particular proposal to execute for its successful implementation in the coming years.”

ASM CEO Hichem M’Saad (LINK)
“We commend the choice to establish the NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility in Arizona, a state at the forefront of a thriving semiconductor industry.”

University of California President Michael Drake (LINK)
“In partnership with Arizona State University, the University of California system is ready to get to work designing, prototyping, and packaging the next generation of semiconductors, while also training engineers to maintain U.S. semiconductor leadership through the 21st century and beyond.”

U.S. Secretary of Commerce Gina Raimondo (LINK)
“Arizona has long been a hub for technological progress, and this new facility will strengthen our domestic supply chain, drive advanced manufacturing breakthroughs, and secure America’s leadership in this critical industry.”

Natcast CEO Deirdre Hanford (LINK)
“This facility will be a premier destination where researchers from industry, academia, startups, and the broader semiconductor ecosystem will convene to explore, experiment, and collaborate on the next generation of semiconductor and packaging technologies that will power the industries of the future.”

Applied Materials President of Semiconductor Products Group Dr. Prabu Raja (LINK)
“Applied Materials has a long and successful history of collaborating with industry and research partners in Arizona, and we are pleased to participate in the growth of the region in support of U.S. leadership in semiconductors.”

Amkor Executive Vice President of Business Units Kevin Engel (LINK)
“This facility promises to accelerate innovation that will advance U.S. competitiveness and supply chain resilience, and at Amkor, we look forward to supporting its long-term success.”

University of Central Florida President Alexander Cartwright (LINK)
“University of Central Florida is pleased to support ASU, the U.S. Department of Commerce, and Natcast’s efforts to invent the future of semiconductors and train the next generation of talent right here in the United States.”

Brewer Science Chief Technical Officer Rama Puligadda (LINK)
“As Brewer Science continues to pioneer next-generation materials needed for chip innovation, we look forward to partnering on this important research effort for our industry and supporting its long-term success.”

Deca Technologies CEO Tim Olson (LINK)
“This once in a generation investment will boost the entire semiconductor industry with powerful capabilities to further develop and scale new technologies."

Microchip Technology Inc CEO and President Steve Sanghi (LINK)
“Arizona is home to a vibrant and rapidly expanding semiconductor ecosystem and is uniquely positioned to host this facility.”

SkyWater CEO Thomas Sonderman (LINK)
“SkyWater is pioneering advancements for next-generation packaging, providing a historic opportunity for collaboration with industry and research leaders.”

NY CREATES President Dave Anderson (LINK)
“We welcome ASU as a critical peer supporting the NSTC’s mission…Together, our collective efforts will drive transformative innovation, strengthen the U.S. semiconductor ecosystem, and ensure our nation’s leadership in next-generation technologies.”

Arizona Board of Regents Chair Cecilia Mata (LINK)
“The selection of Arizona State University as a key site for the National Semiconductor Technology Center’s Prototyping and Advanced Packaging Piloting Facility is a defining moment in Arizona’s rise as a hub of innovation and technology.”

Arizona Republic (LINK)
“The ASU Research Park facility will benefit from proximity to Arizona’s fast-growing semiconductor industry, with major manufacturers, including Taiwan Semiconductor Manufacturing Co. and Intel Corp. growing their presence in the state, along with advanced packaging facilities like Amkor Technology Inc.”

Phoenix Business Journal (LINK)
“The new Tempe semiconductor facility will combine 300mm silicon wafer research and prototyping for front-end manufacturing and chip packaging capabilities, playing a critical role in advancing semiconductor innovation across the country. It’s expected to be operational in 2028.”

Media Contact
Alyssa Tufts, Arizona Commerce Authority, [email protected]